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深入瞭解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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Use of temporary bonding/debonding as part of thin wafer handling processes is rapidly increasing. Users must determine which temporary bonding/debonding method is appropriate for a specific application. Some of the technologies that have been developed are chemical release, thermal slide separation, and ZoneBOND® debonding. The chemical release process requires very little force to release the…
Click Here to Read MoreArticle published in Chip Scale review's March - April 2018; Volume 22, Number 2 Issue The semiconductor industry is in a new age where device scaling will not continue to provide the cost reductions or performance improvements at a similar rate to past years when Moore’s law was the guiding principle for IC scaling. The…
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