Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
深入瞭解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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https://youtu.be/awhT-hfWwyg Brewer Science Recognized as Certified B CorporationTM Global technology leader meets highest standards of corporate social and environmental performance, transparency, and accountability to all their stakeholders. Rolla, Mo.–May 2021–…
May 17, 2021 Press Release Read MoreBrewer Science Recognized as Outstanding Exporter for the State of Missouri by NASBITE International NASBITE International honors 39 outstanding small-medium business exporters for their growth and innovative approaches to international…
Read MoreBrewer Science Expands Capabilities: Smart Devices & Printed Electronics Foundry Rolla, Mo. March 23, 2021 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and…
Read MoreRolla, Mo. March 1, 2021 – Brewer Science Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, today announced the appointment…
Read MoreRolla, Mo.–February 2021–Brewer Science, a global technology leader, is pleased to announce it has earned Zero Waste to Landfill Certification for the sixth consecutive year. The Zero Waste to Landfill…
Read MoreRolla, Mo.–January 1, 2021– Brewer Science is celebrating 40 years of being a global leader in developing and manufacturing advanced materials utilized in cutting-edge micro-devices. Dr. Terry Brewer founded Brewer…
Read MoreAlice Guerrero, Senior Applications Engineer in Wafer-Level Packaging at Brewer Science, and Koen Kennes, Research and Development Engineer at imec, contributed to Chip Scale Review with a discussion of the…
Read MoreKim Arnold, Chief Development Officer, and Kim Yess, Executive Director of WLP Materials, sat down with SiS to discuss temporary bonding and debonding materials that are enabling next generation semiconductor…
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