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Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023 Innovative bonding materials presented at leading Asia technology conferences Tapei, Taiwan – August 28, 2023…
Event Read MoreBrewer Science is one of only 22 Distinguished Award recipients across Intel’s global supply chain Rolla, MO, June 22, 2023 – Brewer Science is proud to announce that it…
Read MoreBrewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes OptiStack® SOC450 material provides zero shrinkage up to 550°C when baking in N2 June 15, 2023 – Rolla,…
Read MoreImec and Brewer Science present process solutions for CVD oxide deposition processes on ultrathin wafers at Electronic Components and Technology Conference (ECTC) Process challenges during CVD oxide deposition on the…
Read MoreCo-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25, 2023 – Brewer Science, Inc. and PulseForge, Inc. bring substantial…
Read MoreNew developments in underlayers play key role in advanced EUV lithography Rolla, Mo.– April 11, 2023 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials for…
Read MoreBrewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Eighth Consecutive Year Brewer Science is the first company in the semiconductor industry with GreenCircle Certification Rolla, Mo.– March…
Read MoreReal-time measurement of lead, nitrate and pH using printed sensors presented at LOPEC Munich, Germany – February 21, 2023 – Brewer Science, Inc., a global leader in developing and…
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