Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
深入瞭解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
深入瞭解Show Me | All News | Blog | Ebooks | Videos | Press Releases | Events |
---|
February 15- 17, 2017 Tokyo, Japan Brewer Science is co-exhibiting with OE-A (Organic and Printed Electronics Association). Booth: 6B-28 Conference Website
Feb 15 - 17, 2017 Event Read MoreFor centuries, humans have tried to harness the seemingly endless power of the sun. And now, it seems like we’re making some big strides. Here are just a few amazing…
Read MoreJanuary 8-11, 2017 Half Moon Bay, California Brewer Science is proud to sponsor two sessions at the 2017 SEMI ISS. The first is the keynote session entitled ‘Data Center: Innovation,…
Read MoreDecember 14-16, 2016 Tokyo, Japan Booth: 3408 SEMICON Japan is the premier exposition for microelectronics manufacturing supply chain. Brewer Science products will be on display at our booth. Emerging Brewer Science…
Read MoreDecember 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology…
Read MoreDecember 07, 2016 – San Francisco, CA – Brewer Science is pleased to announce that Dr. Dongshun Bai, Senior Program Manager, will be speaking on new temporary wafer bonding technology…
Read MoreNovember 30, 2016 – Tokyo, Japan – Make plans to visit with Brewer Science’s team of experts during SEMICON Japan 2016, which will be held December 14 through 16 at…
Read MoreNovember 16-17, 2016 Santa Clara, California Booth: T19 Presentation: Carbon Nanomaterials: Defining the Future of High-Speed Printed Sensors Time: November 16th, 2016 | 13:55 - 14:15 By: Nick Anthony and Rob Frueh…
Read More