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December 6-9, 2017 Event
EPTC 2017

December 6-9, 2017 Singapore, Grand Copthorne Waterfront Hotel Brewer Science’s Ram Trichur, Business Development Director, to present an invited talk at EPTC: Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes…

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December 5 - 7, 2017 Event
3D ASIP

Tuesday, December 5, 2017 San Francisco, CA, USA   Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer…

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October 15, 2017 Blogs
How can glass survive rigorous back end processes?

Brewer Science is headed to the CS ManTech conference May 18 through 21!  CS ManTech is a respected organization focused on providing a forum for members of the compound semiconductor…

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October 15, 2017 Blogs
Brewer Science continues push toward zero-landfill status

Here at Brewer Science, we are striving to reach zero-landfill status. Our efforts in environmental responsibility include our mini-bin recycling program and our installation of efficient water and electrical fixtures.…

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October 15, 2017 Blogs
Where is the spin-coating industry headed?

We sat down with our engineers to get their insights on where the spin-coating industry is headed. We were met with an overwhelming response identifying the need for data streaming…

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October 15, 2017 Blogs
Temporary Bonding and the Importance of Thermal Stability

Noted author and futurist Ray Kurzweil wrote back in 2001, "We won’t experience 100 years of progress in the 21st century — it will be more like 20,000 years of progress.…

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October 15, 2017 Blogs
3-D Stacking and the Future of Integrated Circuits

In the early 1970s, Intel co-founder Gordon E. Moore coined the famous Moore's Law, predicting that the number of transistors in integrated circuits (and by extension, processing power) would double…

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