Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
深入瞭解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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Brewer Science will be exhibiting at booth #518 at SEMIEXPO Heartland. More information can be found in our press release. April 1–2, 2025 Indiana Convention Center 100 S. Capitol Ave.…
December 09, 2024 Read MoreDougal Guerrero, Ph.D. will present "New materials towards sustainable manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.
Read MoreMulti-Tier Die Stacking Enables Efficient Manufacturing Achieve higher integration density with collective die-to-wafer bonding Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing…
Read MoreBrewer Science Elevates Two Corporate Leaders to Chief Executive Role Corporate leadership developments to drive projected growth and innovation Rolla, MO – October 10, 2024 – Brewer Science, Inc., a…
Read MoreBrewer Science presents Materials Innovation for Additive Electronics at InterPACK 2024 Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing San Jose, California – October…
Read MoreBrewer Science Elevates Veteran Leader and Welcomes New Market Strategy Officer to Propel Future Growth in Semiconductor Industry Corporate leadership developments to drive projected growth and innovation Rolla, MO…
Read MoreBrewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE Achieving High-Volume, Zero-Defect Quality Polymer Purification San Diego, CA – October 23, 2024 – Brewer Science, Inc., a…
Read MoreFive Questions to Ask When Selecting a Temporary Bonding and Debonding System Thin-wafer handling requires strategic material selection High-bandwidth memory blocks (HBM) memory, microprocessors, field-programmable gate arrays (FPGA), AI…
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