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Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference Austin, TX– April 7, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025…
Event Read MoreDr. Andrea Chacko will present Temporary Materials for Chiplet Integration at CMC 2025 in Austin, Texas. View Agenda
Read MoreBrewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference Austin, TX– April 7, 2025 – Brewer Science, Inc., a global leader in…
Read MoreNextFlex Innovation Days – March 26 – March 27 Brewer Science will be exhibiting at NextFlex Innovation Days in Santa Clara, California. Dr. Terry Brewer will give a keynote presentation.…
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