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Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference Austin, TX– April 7, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025…
Event Read MoreNextFlex Innovation Days – March 26 – March 27 Brewer Science will be exhibiting at NextFlex Innovation Days in Santa Clara, California. Dr. Terry Brewer will give a keynote presentation.…
Read MoreMarch 31, 2025
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March 19, 2025
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March 07, 2025
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