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Fabrication of microelectronic devices increasingly involves the creation of high-aspect-ratio structures (those with large height or depth and narrow width, such as trenches, vias, columns, and mesas). These structures provide…
October 15, 2016 Blogs Read MoreOver the past decade, Brewer Science has developed and published various methods of creating a planar surface over three-dimensional (3-D) structures. Sharing these results invariably leads to a potential customer…
Read MoreAt the Science Café event held at Farmers Gastropub on April 19, James E. (Jim) Lamb III, Brewer Science Corporate Technology Strategist and Director of the Printed Electronics Technology Center,…
Read MoreAs semiconductor devices evolve, smaller and smaller feature sizes are required to achieve the performance desired by the consumer. Smaller features give rise to lower power consumption for mobile devices,…
Read MoreOne of the most critical variables in spin-coating processes is coating uniformity. In many cases, engineers are challenged with achieving ultralow total thickness variation at high film thicknesses while conserving…
Read MoreWearable devices are all the rage right now, from FitBit products and the Apple Watch to the ever-evolving and highly anticipated Google Glass. But the idea and creation of wearable…
Read MoreIn 1977, Intel introduced the 16-bit CPU at a small inaugural semiconductor event in Tokyo. While that 16-bit marvel is now a relic in the computing world, that little event…
Read MoreRemember WWII’s Rosie the Riveter, the strong and capable figure symbolizing real-life women who took over factory work for men fighting overseas? Manufacturers are wishing Rosie would make a comeback…
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