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Developing photosensitive film layers to produce features of targeted sizes is a critical process step within any photolithography application. Application engineers have created several processes for performing this step with…
October 15, 2018 Blogs Read MoreThermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage…
Read MoreIn addition to precisely controlling application of the materials that enable wafer bonding, a solvent-enriched sealed spin chamber contributes to process integrity. One of the most critical variables in achieving…
Read MoreThe microelectronics industry is rapidly migrating to fabricating 3-D wafer stacking interconnects using through-silicon via (TSV) technology. Major market segments seeking to benefit from TSV technology include advanced packaging for…
Read MoreIn its constant quest to innovate, Brewer Science is continually on the cutting edge of what is next. We are currently combining directed self-assembly (DSA) and lithography to achieve sub–10…
Read MoreIn recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review. The feature discusses the company’s use…
Read MoreThe Internet of Things (IoT) includes a number of different applications throughout a wide assortment of industries. In our first breakdown of applications within the IoT, we discussed how Brewer…
Read MoreThe Internet of Things (IoT) has made substantial strides since first being envisioned in 1999, having moved beyond machine-to-machine communications, toward impacting a variety of industries with “smart” devices. Nearly…
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