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Five Questions to Ask When Selecting a Temporary Bonding and Debonding System Thin-wafer handling requires strategic material selection High-bandwidth memory blocks (HBM) memory, microprocessors, field-programmable gate arrays (FPGA), AI…
August 01, 2024 Blogs Read MoreBrewer Science is featured in The Wall Street Journal article, "American Manufacturers Seek Perfection as Quality Issues Mount" published on March 18, 2024. You can view the full article here.…
Read MoreA high-level overview of wafer-level debonding options and considerations As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding…
Read MoreSpecial thanks to Phelps County Focus for featuring this article on November 16, 2023 By Hannah Martinez, Staff Writer at Phelps County Focus hannah@phelpscountyfocus.com Einstein’s General Theory of Relativity states…
Read MoreMethods on how to detect and reduce defects in the fab and supply chain Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent…
Read MoreJoin Tom Brown, Executive Director, Semiconductor Business Unit at Brewer Science, as he shares inspirational leadership advice and professional growth stories. At Brewer Science, we have developed a Competency…
Read MoreThree Steps to Defect Reduction in Semiconductor Materials How to Identify Impurities Through Polymer Analysis Brewer Science conducts polymer analysis and characterization as a fundamental step in quality assurance and…
Read MoreNine Essential Criteria to Achieve a Successful Bonding Process A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS…
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October 27-31, 2024 • San Deigo, CA [+]
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