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Dr. Terry Brewer’s discovery of anti-reflective coatings resulted in a revolution in the global microelectronics industry and ushered in today’s high-speed, lightweight electronic devices.

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Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.

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Our line of products stretches across the whole spectrum of lithography wavelengths and is the most comprehensive product lineup in the industry.

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At Brewer Science, we are focused on delivering critical, real-time information to our customers to help them achieve their goals, solve their problems, and improve their current systems.

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Bonding Materials BrewerBOND^® 230 BrewerBOND^® 305 BrewerBOND^® T1100/C1300 WaferBOND^® HT-10.11

Debonding Technologies BrewerBOND^® 530 BrewerBOND^® 510 BrewerBOND^® 701

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Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.

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Terry Brewer 博士所發現的抗反射塗層，為全球微電子產業帶來突破性的改變，並開創了現今高速輕量級的電子裝置。

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Advanced Materials

Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.

Protective Hard Coatings

Optical Coatings

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我們的產品線囊括所有微影技術的範疇，並擁有業界最完整的產品組合。

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Brewer Science 致力為客戶提供重要即時的資訊，協助他們達成目標、解決問題並改善既有系統。

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Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.

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BrewerBOND^® 230
BrewerBOND^® 305
BrewerBOND^® T1100/C1300
WaferBOND^® HT-10.11

剝離技術

BrewerBOND^® 530
BrewerBOND^® 510
BrewerBOND^® 701

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SEMICON Europa 2025

Munich, Germany

Brewer Science will be exhibiting at booth #C1469 at SEMCION Europa in Munich, Germany.

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Dr. Terry Brewer's antireflective coatings revolutionized microelectronics manufacturing and ushered in today's high-speed lightweight electronic devices... 布魯爾科技已再次做好準備，帶領業界邁向新世代！

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Brewer Science�s Dr. Douglas Guerrero Honored as SPIE Fellow ��Brewer Science Welcomes New Chief Business Officer, Poupak Khobadandeh Innovation in hybrid bonding and laser debonding presented at EPTC in Singapore

即將舉辦的活動

Electronics, Appliance & Tire Collection - 2025 Recycling Event at Brewer Science Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material featured in Chip Scale Review Integration Engineering and Novel Underlayers Presented at SPIE Advanced Lithography + Patterning 2025 CMC 2025 2025 IWLA Convention & Expo

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