ROLLA, Mo. and SHANGHAI – March 13, 2018 – Brewer Science, Inc. is pleased to announce its participation in SEMICON China 2018, March 14-16, 2018 at the Shanghai New International Expo Centre. As China endeavors to build its local semiconductor manufacturing infrastructure, Brewer Science is well positioned to support the region as a materials supplier. Brewer Science will showcase its offerings in both wafer-level packaging and front-end lithography materials, along with longtime industry partner Nissan Chemical. Additionally, at the China Semiconductor Technology and International Conference (CSTIC) being held in conjunction with SEMICON China, Brewer Science’s Dr. Dongshun Bai will present at the packaging and assembly symposium, while the company’s Dr. Zhimin Zhu will speak at the lithography and patterning symposium.
China has seen rapid expansion over the last few years as its government works to correct the imbalance created by being the world’s largest electronics manufacturing market, while having to import most of its semiconductor devices. According to SEMI market reports, in 2016, China’s fabless companies doubled from 736 to over 1,300. From 2015 to 2018, new fab projects beginning production in China have outpaced other regions, causing a 3X increase in front-end fab equipment sales. As a result, China has moved into second place in worldwide fab equipment spending.
“China’s semiconductor industry is reaching a pivotal point in its history, as it sets a course to become competitive in both front- and back-end manufacturing,” said Kim Arnold, Executive Director Advanced Packaging Business Unit, Brewer Science. “We look forward to partnering with the local semiconductor supply chain by supporting advanced process and materials development.”
Technology Trends
Mobile computing, 5G, artificial intelligence (AI), augmented and virtual reality, and the internet of things are all areas of opportunity for China. In particular, with the popularity of its social media platform, WeChat, AI and the move to a data-centric market will have a significant impact on China’s semiconductor market.
Back-End Trends
China’s advanced packaging sector is well established, with 150 package and assembly plants comprising 80 outsourced semiconductor assembly and test service providers (OSATs) and 17 bumping facilities. While most of the OSATs focus on traditional packaging, they have started increasing their offerings of advanced packaging solutions. In particular, advancements in fan-out wafer-level packaging (FOWLP) processes will help the region compete as the technology focus shifts from following Moore’s law to heterogeneous integration.
Brewer Science’s advanced packaging solutions include temporary bond/debond materials, redistribution layer (RDL)-first FOWLP build-up layer materials, and temporary base protection layers. The company looks forward to working closely with its Chinese customers to help them realize better packaging capabilities.
To learn more about Brewer Science’s back-end materials and processes, be sure to attend the CSTIC presentation by Dr. Dongshun Bai titled “Laser Release Technology for Wafer-Level Packaging” on Monday, March 12. Details are available here.
Front-End Trends
Despite measurable success in expanding its front-end capacity, China still lags in terms of technology nodes. Technological advancements in China have been on a shortened timeline, in comparison with all other semiconductor markets. In an attempt to keep up the pace, Chinese semiconductor manufacturers have proposed and pursued a number of mergers and acquisitions, with minimal success. However, progress is pushing forward without the benefit of these acquisitions.
As scaling efforts slow globally, China now has an opportunity to be the industry leader to the rest of the world in developing advanced node technology. As a technology innovator, Brewer Science stands ready to work with Chinese customers, industry partners, universities and research consortia to engage in roadmap-enabling technology development. For example, Brewer Science’s R&D investments in advanced lithography have resulted in materials solution sets that include multilayer, extreme ultraviolet, directed self-assembly and planarization materials.
To learn more about Brewer Science’s R&D efforts, be sure to attend the CSTIC presentation by Dr. Zhimin Zhu titled “High-Fidelity Lithography Against Stochastic Effects” Monday, March 12. Details are available here.
To learn more about Brewer Science’s activities in China, as well as its latest advancements in specialty materials and processes for lithography, stop by its booth #2635. Brewer Science’s advanced wafer-level and packaging solutions will be exhibited by industry partner Nissan Chemical at booth #2531.
About Brewer Science
Brewer Science is a global technology leader in developing and manufacturing innovative materials and processes for the reliable fabrication of cutting-edge microdevices used in electronics such as tablet computers, smartphones, digital cameras, televisions, LED lighting and flexible technology products. In 1981, Brewer Science revolutionized lithography processes with its invention of ARC® materials. Today, Brewer Science continues to expand its technology portfolio to include products enabling advanced lithography, thin-wafer handling, 3D integration, and chemical and mechanical device protection and products based on nanotechnology. With its headquarters in Rolla, Missouri, Brewer Science supports customers throughout the world with a service and distribution network in North America, Europe and Asia. We invite you to learn more about Brewer Science at www.brewerscience.com, follow us on Twitter at @BrewerScience, like us on Facebook at http://www.facebook.com/BrewerScience or subscribe to our blog.
Company Contact:
Loretta Wallis
Tel: (US) +1.573.364.0300
Email: mwallis@brewerscience.com
Asia Press Contact:
Ina Chu
Tel: (US) +1.217.766.1011
Email: ichu@kiterocket.com
